Wafer Probe

Integra Technologies has the engineering talent, equipment and processes in place to support all wafer probe services, including test software development, probe card design/fabrication, debug and production probing. 

Experience with all probe card technologies including:

• Cantilever: 1- 16 sites up to 800 probes
• Vertical: Multi site up to 64 sites
• Membrane: Multi site
• MEMS probe cards
• RF probe to 40 GHz and higher
• Wafer probing -55°C to +125°C
• Elevated probing up to 180°C
• Singulated die probe, -55°C to +125°C, pin count to 8000+ pads
• Bumped or unbumped wafer probe

Wafer probe data analysis throughout your startup and ongoing production probe:

• Wafer Map Conversion
• Retest of defined bins without full wafer reprobe
• Custom mapping for inkless assembly
  • Onsite custom format solutions for inkless assembly
  • Assembly back to production map conversion
  • Wafer inspection map conversion to electrical test maps
• Wafer Analysis
  • Composite Mapping
  • Multi site comparison
  • Integration to Galaxy^® software

Summary of Probe Capabilities:

• 2” to 12” wafer capability
• Probe card design, fab and verification
• Al, Au pads and Pb, Pb free bumps
• High Z force chuck
• High pin count, fine pitch
• Multi site
• RF probe (Membrane, Coax or custom solutions)
• N2 and vacuum wafer storage
• Data analysis capability
• High volume production probe
• 5 mil thick wafers
• 20+ years of wafer probe experience
• 100 million plus die probed
• 24x7 production capability
• 25+ test engineers