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Full military semiconductor test and qualification services including; up-screening, PEM quals, copper wire qualifications and DMEA "Trusted" processing for the Military, Space, Aerospace and Avionics markets.
Full production, high volume wafer probe for standard products and custom ASICs.
A full array of high volume packaging and final package test services.
Test software development, characterization and qualification for all semiconductor technologies including RF, Mixed Signal, Analog, Linear & Digital devices.
Comprehensive MIL-STD-1580 Destructive Physical Analysis (DPA) services for all device technologies.
Fully equipped Failure Analysis (FA) laboratory for determining root cause failure mechanisms.
Tightly controlled and repeatable test and qualification services for demanding medical applications.
Integra is an industry leader in combating the proliferation of counterfeit semiconductor devices utilizing comprehensive mechanical analysis and full electrical test techniques.
Integra has one of the largest and most experienced test engineering organizations as well as one of the broadest arrays of test equipment in the industry
Integra Technologies LLC provides semiconductor production testing (wafer probe and final test), qualification, and related technical services to manufacturers and users of semiconductor devices. In business for more than 30 years, we serve the Fabless Semiconductor, Aerospace, Space, Military, Medical, Automotive, Industrial and Commercial markets with our test services.
Integra offers these services from its locations in Wichita, Kansas and Albuquerque, NM and has earned an outstanding reputation for quality, technical expertise and on-time delivery.
Integra has one of the largest and most experienced test engineering organizations in the industry. We have the engineering expertise in house to support all technologies, including RF, digital, linear, analog mixed signal and memory.
Integra specializes in software development, hardware design and development, full production electrical test, qualification testing, failure analysis and destructive physical analysis. Integra’s electrical test expertise encompasses both final test and wafer probe, including bumped wafer probe.
Bare die testing is essential for optimizing yields in the following applications: